Baolab Creates Nanoscale Mems Inside The CMOS Wafer (OfficialWire)

 
By 11 March 2010
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Baolab Microsystems has announced a new technology to construct nanoscale MEMS (Micro Electro Mechanical Systems) within the structure of the actual CMOS wafer itself using standard, high volume CMOS lines, which is much easier and quicker with fewer process steps than existing MEMS fabrication techniques that build the MEMS on the surface of the wafer.
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